Corintis secures USD 24M to advance chip-cooling technology

26.09.2025 10:50, Rita Longobardi

The rise of artificial intelligence has accelerated demand for high-performance chips, but the industry is running into a fundamental barrier: heat. GPUs and accelerators require vast amounts of energy, producing thermal loads that limit their output. NVIDIA’s recent adoption of liquid cooling illustrates the urgency of this challenge. Without efficient thermal management, even the most advanced processors cannot sustain maximum performance.

Corintis, a semiconductor cooling startup and the last Top100 Swiss Startup Award’s first-classified winner, has emerged from stealth with a USD 24 million Series A. The company integrates cooling directly into chip design, tripling heat removal efficiency compared to conventional approaches. Beyond performance gains, its technology reduces water consumption—addressing a pressing environmental issue for data centres worldwide. With this round, Corintis has raised a total of USD 33.4 million.

The startup currently employs 55 people and plans to grow its team to more than 70 by year-end. It is also scaling its production capabilities, with the aim of manufacturing over one million microfluidic cold plates annually by 2026.

Corintis has also expanded its leadership with industry veterans joining the board. Lip-Bu Tan, former Intel board member, and Geoff Lyon, former CEO of CoolIT, will contribute decades of experience in semiconductors and cooling technologies as the company accelerates its expansion.

The engineering company has consistently stood out, participating in Venture Leaders Mobile, winning Venture Kick, and ranking among the Top100 Swiss Startups for four consecutive years.


Jordi Montserrat (Venturelab), Patrick Forte (UBS), Remco van Erp (Corintis Co-Founder), and Stefan Steiner (Venturelab) on stage at Top100 Swiss Startup Award in September 2025