Kandou Raises astonishing USD 92.3M in Series C funding round to sharpen product advancements

18.11.2020 09:21, Jonatan Masseus

Kandou, considered as an innovative leader in high-speed, energy-efficient, chip link solutions, closes its Series C round, resulting in USD 92.3M raised. The funding round was led by Bassemer Venture Partners, Climb Ventures, and Flexstone Partners.

Kandou, spun out of EPFL in 2011, is an innovative leader in high-speed, energy-efficient, chip-to-chip link solutions critical to the evolution of the electronics industry, is revolutionizing wired connectivity with greater speed and efficiency. It enables a better-connected world by offering disruptive technology through licensing and standard products for smaller, more energy-efficient, and cost-effective electronic devices. Kandou offers fundamental advances in interconnect technology that lower the power consumed and improve the performance of chip links, unlocking new capabilities for customer devices and systems. Having their headquarter in Lausanne, Switzerland, with offices stretching from Europe to North America and Asia

The financing round was led by Bessemer Venture Partners, Climb Ventures, and Flexstone Partners. Kandou's new capital will be used to bring their first silicon product known as Matterhorn, a USB-C® multiprotocol retimer solution with support for USB4™, to market to enable consumer and networking applications for electronic devices. Additionally, the funds will be used for the development of their Chord™, and Glasswing™. 

Kandou has been supported by Venture Kick and listed as a TOP100 startup. This year they have been listed as a TOP 100 Scale-Up start-up.